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HYG896F01003A

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HYG896F01003A
Production process

Specification
Code HYG896F01003A Customer PN CP-1706/15100/010MO/751

Layer 1 Blind/Buried Via NO

Base Material PI Unit Size(mm) 320.0000
X 230.0000
Board thickness 0.12mm Panle Size(mm) /
X /
Min hole / Pcs/Panle 1 X 1
Total Holes / Copper OZ(finish) / Base Cu HOZ
W/S(mil) 11.8 Min Hole Copper Thickness /

Outline Finish CNC
Finish thickness tolerance +/-10%

Contour tolerance +/-0.1mm Surface Finishing
HASL Lead Free


X-out / Solder Mask /

Special request
Silkscreen /
Customer Evaluation
20170809113338_62641_副本_副本.jpg 20170809115057_80100_副本.jpg one.jpg 20170809115226_98108_副本.jpg

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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